The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Sep. 24, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Joseph Cleary Blakemore, Stow, OH (US);

Troy David Hazelton, Sagamore Hills, OH (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01); G01J 5/00 (2006.01); G01J 5/20 (2006.01); G01J 5/04 (2006.01); F23M 11/04 (2006.01); F23N 5/08 (2006.01); H05K 5/00 (2006.01); H02G 15/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); F23M 11/045 (2013.01); F23N 5/082 (2013.01); G01J 5/0018 (2013.01); G01J 5/042 (2013.01); G01J 5/045 (2013.01); G01J 5/20 (2013.01); H01L 31/02 (2013.01); H01L 31/02005 (2013.01); H05K 5/00 (2013.01); F23N 2029/00 (2013.01); F23N 2900/05005 (2013.01); H02G 15/025 (2013.01);
Abstract

A sensor assembly for a flame sensor apparatus includes a photodiode that generates a current. The sensor assembly includes a seal assembly supporting the photodiode. The seal assembly includes an inner conductor defining an inner conductor end. The inner conductor includes an inner conductor surface disposed at the inner conductor end. The photodiode is attached to the inner conductor end of the inner conductor and to a middle conductor end of a middle conductor. The photodiode is electrically connected to the inner conductor surface. The seal assembly is triaxial so as to protect the current generated by the photodiode. The seal assembly withstands temperatures up to or greater than about 325° C. The seal assembly forms a hermetic barrier that, with the photodiode supported within a sealed volume, limits the passage of materials/gases through the seal assembly.


Find Patent Forward Citations

Loading…