The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Jan. 13, 2015
International Business Machines Corporation, Armonk, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Chip mounting is provided in which the pitch between bumps can be further narrowed without establishing contact between bumps. In a chip mounting structure in which a flip-chip bond has been established between a chip and a board via bumps, the bumps are provided so that the height position of the bumps from the connection surface of the chip or the connection surface of the board has a difference in height exceeding the thickness of adjacent bumps. This further narrows the pitch between bumps without establishing contact between the bumps.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile