The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Sep. 04, 2013
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Shiro Yamashita, Tokyo, JP;
Hideto Yoshinari, Hitachinaka, JP;
Takashi Kume, Hitachinaka, JP;
Shinichi Fujino, Hitachinaka, JP;
Eiichi Ide, Tokyo, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
The present invention relates to a power module obtained by connecting the opposite sides of a chip with solder, and prevents the side surfaces of a base portion from becoming wet with solder, which would otherwise cause connection failures of the solder or chip displacement, and also prevents peeling of molding resin, which would otherwise break the chip or shorten the life of the solder. The base portion is integrally formed with one of lead frames, and the side surfaces of the base portion and the surface of the main body of the lead frame are roughened so as to have reduced solder wettability. Meanwhile, the solder connection surface of the base portion is not roughened so as to ensure the solder wettability. Accordingly, it is possible to reduce failures that may occur during solder connection and obtain a highly reliable power module (FIG.).