The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Dec. 18, 2012
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Eiji Nukaga, Kyoto, JP;

Hiroshi Tamagawa, Kyoto, JP;

Yasuhiro Kondo, Kyoto, JP;

Katsuya Matsuura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/18 (2006.01); H01C 7/00 (2006.01); H01C 13/02 (2006.01); H01C 17/06 (2006.01); H01C 17/242 (2006.01); H01C 17/00 (2006.01); H01G 2/06 (2006.01);
U.S. Cl.
CPC ...
H01C 7/006 (2013.01); H01C 7/00 (2013.01); H01C 13/02 (2013.01); H01C 17/006 (2013.01); H01C 17/06 (2013.01); H01C 17/242 (2013.01); H01G 2/065 (2013.01); Y10T 29/49082 (2015.01);
Abstract

[Subject]To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor. [Solution] The chip resistor () includes: a board () having a device formation surface (A), a back surface (B) opposite from the device formation surface (A) and side surfaces (C-F) connecting the device formation surface (A) to the back surface (B), a resistor portion () provided on the device formation surface (A), a first connection electrode () and a second connection electrode () provided on the device formation surface (A) and electrically connected to the resistor portion (), and a resin film () covering the device formation surface (A) with the first connection electrode () and the second connection electrode () being exposed therefrom. Intersection portions () of the board () along which the back surface (B) intersects the side surfaces (C-F) each have a rounded shape.


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