The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Aug. 26, 2013
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventor:

Massimo Civilini, Redwood City, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/50 (2006.01); G05B 13/04 (2006.01); H05K 7/14 (2006.01); G05D 23/19 (2006.01); G01K 7/42 (2006.01); H01L 23/34 (2006.01); G06F 1/20 (2006.01); G06F 17/50 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 9/5094 (2013.01); G01K 7/427 (2013.01); G05B 13/048 (2013.01); G05D 23/193 (2013.01); G05D 23/1917 (2013.01); G06F 1/206 (2013.01); G06F 17/5009 (2013.01); H01L 23/34 (2013.01); H05K 7/1497 (2013.01); H05K 7/20836 (2013.01); G06F 2217/80 (2013.01); Y02B 60/142 (2013.01);
Abstract

A system for managing a data center including a plurality of electronic components, each of which are configured to generate varying levels of heat loads under varying power level utilizations, is disclosed. The system may comprise a data collection module adapted to collect data describing heat loads generated by the plurality of electronic components; an implementation module adapted to implement a model to predict a thermal topology of the data center, wherein the model is based on thermodynamic state equations; and a control module adapted to adjust the heat load of at least one of the plurality of electronic components based on the model.


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