The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Jan. 21, 2014
Hoya Corporation, Tokyo, JP;
Suguru Imafuku, Gunma, JP;
HOYA CORPORATION, Tokyo, JP;
Abstract
A method permits the fabrication of a silicone-containing copolymer molded article having a hydrophilic surface by cast molding and without employing a high-molecular-weight hydrophilic polymer even when employing a polypropylene mold. The method polymerizes a monomer solution containing a silicone monomer having a (meth)acryloyl group; a hydrophilic monomer having a vinyl group; a crosslinkable monomer; and a polymerization initiator in a cavity of a mold having a hydrophobic cavity surface. The polymerization initiator has a 10-hour half-life temperature of 70° C. or higher and 100° C. or lower, and the polymerization is conducted by maintaining a temperature within a range of from the temperature of the polymerization initiator contained in the monomer solution to 35° C. below the temperature for one hour or more; and maintaining a temperature higher than the temperature of the polymerization initiator contained in the monomer solution for one hour or more.