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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9528732 B1

PDFFull Text
Date of Patent:
Dec. 27, 2016

Filed:

Oct. 24, 2013

Heat pump apparatus

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung Goo Kim, Hwaseong, KR;

Hyo Ju Moon, Suwon, KR;

Jong Youb Kim, Suwon, KR;

Jae Hyuk Oh, Seongnam, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, KR;

Attorney:

Staas & Halsey LLP

Primary Examiner:

Ryan J Walters

Assistant Examiner:

Joseph Trpisovsky

Int. Cl.
CPC ...
F25B 7/00 (2006.01); F25B 39/04 (2006.01); F25B 27/00 (2006.01); F25B 30/02 (2006.01); F25B 13/00 (2006.01); F25B 25/00 (2006.01); F24D 3/18 (2006.01); F24D 17/00 (2006.01); F24D 17/02 (2006.01); F24D 19/10 (2006.01);
U.S. Cl.
CPC ...
F25B 30/02 (2013.01); F24D 3/18 (2013.01); F24D 17/001 (2013.01); F24D 17/02 (2013.01); F24D 19/1072 (2013.01); F25B 7/00 (2013.01); F25B 13/00 (2013.01); F25B 25/005 (2013.01); F24D 2200/31 (2013.01); F25B 2313/009 (2013.01); F25B 2313/0292 (2013.01); F25B 2313/02732 (2013.01); F25B 2313/02743 (2013.01); F25B 2339/047 (2013.01); Y02B 30/52 (2013.01);
Abstract

A heat pump apparatus is provided. The heat pump raises the water temperature during a hot-water supply without using a separate heat source such as a heater. The heat pump apparatus includes an outdoor unit including a first compressor, a first heat exchanger, and a first expansion valve. The heat pump apparatus includes an indoor unit including a second heat exchanger and a second expansion valve, a hydro unit including a second compressor, a third heat exchanger, a fourth heat exchanger, a fifth heat exchanger, a third expansion valve, a fourth expansion valve, and a fifth expansion valve. The heat pump apparatus includes a refrigerant flow path switching unit to switch among flow paths, and a water flow path switching unit to switch between flow paths of the water.

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