The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Sep. 26, 2014
Applicant:
Stmicroelectronics (Malta) Ltd, Kirkop, MT;
Inventor:
Conrad Cachia, Tarxien, MT;
Assignee:
STMICROELECTRONICS (MALTA) LTD, Kirkop, MT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0023 (2013.01); B81B 7/0074 (2013.01); B81C 2203/0792 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/94 (2013.01); H01L 2924/181 (2013.01);
Abstract
One or more embodiments of the present disclosure are directed to packages that include a stacked microelectromechanical sensor MEMS die and an application-specific integrated circuit (ASIC) die. The smaller of the MEMS die and the ASIC die is stacked on the larger of the MEMS die and the ASIC die. The larger of the two dice may form one or more dimensions of the package. In one embodiment, a bottom surface of the larger of the two dice forms an outer surface of the package. In that regard, the package may take less lateral space on another component, such as a board or other package.