The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Sep. 28, 2012
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Xiuzhang James Zhang, Simpsonville, SC (US);

Haiping Wang, Greenville, SC (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 37/00 (2006.01); F04D 29/44 (2006.01); F03D 1/04 (2006.01); B32B 3/26 (2006.01); B32B 3/12 (2006.01); F01D 5/18 (2006.01); F01D 11/24 (2006.01); C04B 37/02 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 3/30 (2006.01); B32B 15/04 (2006.01); B32B 37/00 (2006.01); F01D 9/02 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 37/16 (2006.01); C04B 37/04 (2006.01); C04B 35/117 (2006.01); C04B 35/48 (2006.01); C04B 35/185 (2006.01); C04B 35/01 (2006.01); C04B 35/515 (2006.01); C04B 35/584 (2006.01);
U.S. Cl.
CPC ...
B32B 3/263 (2013.01); B32B 3/12 (2013.01); B32B 3/26 (2013.01); B32B 3/30 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 15/04 (2013.01); B32B 37/0084 (2013.01); B32B 37/144 (2013.01); C04B 37/025 (2013.01); F01D 5/187 (2013.01); F01D 9/02 (2013.01); F01D 11/24 (2013.01); B32B 37/12 (2013.01); B32B 37/146 (2013.01); B32B 37/16 (2013.01); B32B 2250/03 (2013.01); B32B 2262/105 (2013.01); B32B 2262/106 (2013.01); B32B 2307/304 (2013.01); B32B 2311/00 (2013.01); B32B 2315/02 (2013.01); B32B 2603/00 (2013.01); B32B 2605/18 (2013.01); C04B 35/01 (2013.01); C04B 35/117 (2013.01); C04B 35/185 (2013.01); C04B 35/48 (2013.01); C04B 35/5156 (2013.01); C04B 35/584 (2013.01); C04B 37/003 (2013.01); C04B 37/04 (2013.01); C04B 2237/068 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/363 (2013.01); C04B 2237/365 (2013.01); C04B 2237/368 (2013.01); C04B 2237/38 (2013.01); C04B 2237/403 (2013.01); C04B 2237/405 (2013.01); C04B 2237/406 (2013.01); C04B 2237/597 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/72 (2013.01); F05D 2240/11 (2013.01); F05D 2240/12 (2013.01); F05D 2240/126 (2013.01); F05D 2240/15 (2013.01); F05D 2240/24 (2013.01); F05D 2240/303 (2013.01); F05D 2240/81 (2013.01); F05D 2250/232 (2013.01); F05D 2250/241 (2013.01); F05D 2250/28 (2013.01); F05D 2250/291 (2013.01); F05D 2260/20 (2013.01); F05D 2260/204 (2013.01); F05D 2260/22141 (2013.01); F05D 2300/175 (2013.01); F05D 2300/20 (2013.01); F05D 2300/6033 (2013.01); Y10T 428/24562 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24967 (2015.01);
Abstract

A layered arrangement, a hot-gas path component, and a process of producing a layered arrangement are disclosed. The layered arrangement includes a substrate layer, a ceramic matrix composite layer, and a non-metal spacer between the substrate layer and the ceramic matrix composite layer configured to define one or more pockets. The hot-gas-path component includes a nickel-based superalloy layer, a ceramic matrix composite layer, and a ceramic spacer between the nickel-based superalloy layer and the ceramic matrix composite layer. The ceramic spacer is mechanically secured to one or both of the substrate layer and the ceramic matrix composite layer, and the ceramic spacer is bonded to the substrate layer or the ceramic matrix composite layer. The process includes securing a non-metal spacer between a substrate layer and a ceramic matrix composite layer of the layered arrangement.


Find Patent Forward Citations

Loading…