The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Oct. 18, 2011
Applicants:

Anna Lee Tonkovich, Gilbert, AZ (US);

Thomas Yuschak, Lewis Center, OH (US);

Paul W. Neagle, Westerville, OH (US);

Jennifer L. Marco, London, OH (US);

Jeffrey D. Marco, London, OH (US);

Michael A. Marchiando, London, OH (US);

Lane W. Keyes, Columbus, OH (US);

Soumitra Deshmukh, Dublin, OH (US);

Robert J. Luzenski, Marysville, OH (US);

Inventors:

Anna Lee Tonkovich, Gilbert, AZ (US);

Thomas Yuschak, Lewis Center, OH (US);

Paul W. Neagle, Westerville, OH (US);

Jennifer L. Marco, London, OH (US);

Jeffrey D. Marco, London, OH (US);

Michael A. Marchiando, London, OH (US);

Lane W. Keyes, Columbus, OH (US);

Soumitra Deshmukh, Dublin, OH (US);

Robert J. Luzenski, Marysville, OH (US);

Assignee:

Velocys, Inc., Plain City, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 37/02 (2006.01); B01J 19/00 (2006.01); B23K 1/00 (2006.01); B23K 26/00 (2014.01); B23K 26/20 (2014.01); B23K 26/21 (2014.01); B23K 26/24 (2014.01);
U.S. Cl.
CPC ...
B01J 19/0093 (2013.01); B23K 1/00 (2013.01); B23K 1/0012 (2013.01); B23K 26/24 (2013.01); B01J 2219/0099 (2013.01); B01J 2219/00783 (2013.01); B01J 2219/00806 (2013.01); B01J 2219/00808 (2013.01); B01J 2219/00817 (2013.01); B01J 2219/00822 (2013.01); B01J 2219/00835 (2013.01); B01J 2219/00898 (2013.01); B01J 2219/00988 (2013.01); B23K 2201/14 (2013.01); B23K 2203/02 (2013.01); Y10T 137/0396 (2015.04); Y10T 156/10 (2015.01); Y10T 428/24562 (2015.01); Y10T 428/24802 (2015.01);
Abstract

The invention provides methods of making laminated devices (especially microchannel devices) in which plates are assembled and welded together. Unlike conventional microchannel devices, the inventive laminated devices can be made without brazing or diffusion bonding; thus providing significant advantages for manufacturing. Features such as expansion joints and external welded supports are also described. Laminated devices and methods of conducting unit operations in laminated devices are also described.


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