The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
May. 14, 2013
Applicant:
Sagem Defense Securite, Boulogne Billancourt, FR;
Inventors:
Jean-Christophe Riou, Boulogne Billancourt, FR;
Michel Peyrard, Boulogne Billancourt, FR;
Eric Bailly, Boulogne Billancourt, FR;
Assignee:
SAGEM DEFENSE SECURITE, Boulogne-Billancourt, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01); H05K 7/02 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H05K 1/032 (2013.01); H05K 1/09 (2013.01); H05K 7/02 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/30107 (2013.01);
Abstract
An electronics module for use at high temperature (up to 225° C.) in onboard aviation equipment, the module having a thick layer hybrid circuit covered in a sealing coating of poly-p-xylylene.