The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Sep. 09, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Hyung Gi Ha, Daejeon, KR;
Jae Won Jung, Daegu, KR;
Yong Hwan Kim, Chungcheongnam-do, KR;
Jong Jin Lee, Daejeon, KR;
Ja Ho Koo, Daegu, KR;
Young Hwan Shin, Daejeon, KR;
Dong Kyu Lee, Daegu, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 1/0284 (2013.01); H05K 1/11 (2013.01); H05K 3/383 (2013.01); H05K 3/385 (2013.01); H05K 3/462 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0239 (2013.01);
Abstract
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a granular structure formed on the first surface roughness.