The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Dec. 12, 2013
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Min-Su Jung, Seoul, KR;

Sang-Hyeon Kim, Gyeongsangbuk-do, KR;

Young-Tae Kim, Seoul, KR;

Hong-Beom Kim, Daegu, KR;

Il-Sung Jeong, Gyeongsangbuk-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H04M 1/02 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H04M 1/0277 (2013.01); H05K 3/301 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10371 (2013.01);
Abstract

A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the board assembly may contribute to the reduction of the thickness of an electronic device while being stacked with a battery. Further, the entire socket is exposed to the outside of the shield member, the storage medium may be easily removed.


Find Patent Forward Citations

Loading…