The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Apr. 29, 2015
Applicant:

Mando Corporation, Pyeongtaek-si, Gyeonggi-do, KR;

Inventors:

Jong Gyu Park, Yongin-si, KR;

Han Yeol Yu, Suwon-si, KR;

Assignee:

MANDO CORPORATION, Pyeongtaek-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 5/00 (2006.01); H01P 11/00 (2006.01); H01P 3/12 (2006.01); H01P 3/08 (2006.01); H01Q 1/38 (2006.01); H01P 5/02 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H01P 5/107 (2006.01);
U.S. Cl.
CPC ...
H01P 3/121 (2013.01); H01P 3/08 (2013.01); H01P 5/028 (2013.01); H01P 11/002 (2013.01); H01P 11/003 (2013.01); H01Q 1/38 (2013.01); H05K 1/0242 (2013.01); H05K 1/144 (2013.01); H05K 2201/037 (2013.01); H05K 2201/042 (2013.01); H05K 2203/041 (2013.01); Y10T 29/49018 (2015.01);
Abstract

The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.


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