The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Dec. 11, 2013
Applicants:

Dimitre Latev, San Jose, CA (US);

Arman Hajati, Santa Clara, CA (US);

Darren Todd Imai, Los Gatos, CA (US);

UT Tran, San Jose, CA (US);

Inventors:

Dimitre Latev, San Jose, CA (US);

Arman Hajati, Santa Clara, CA (US);

Darren Todd Imai, Los Gatos, CA (US);

Ut Tran, San Jose, CA (US);

Assignee:

FUJIFILM DIMATIX, INC., Lebanon, NH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B06B 1/02 (2006.01); H01L 41/04 (2006.01); B06B 1/06 (2006.01); H01L 41/047 (2006.01); H01L 41/09 (2006.01); H01L 41/29 (2013.01); B32B 37/18 (2006.01);
U.S. Cl.
CPC ...
H01L 41/042 (2013.01); B06B 1/0622 (2013.01); H01L 41/0475 (2013.01); H01L 41/098 (2013.01); H01L 41/29 (2013.01); B32B 37/185 (2013.01); B32B 2457/00 (2013.01); Y10T 156/10 (2015.01);
Abstract

Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.


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