The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Jun. 06, 2013
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tomoko Higashiuchi, Tsukuba, JP;

Nobuaki Takane, Tsukuba, JP;

Masashi Yamaura, Tsukuba, JP;

Maki Inada, Tsukuba, JP;

Hiroshi Yokota, Chikusei, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/44 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/44 (2013.01); H01L 33/54 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01);
Abstract

An optical semiconductor device includes a substrate that has a silver plating layer formed on a surface, a light emitting diode that is bonded to the silver plating layer, a light reflecting portion that surrounds the light emitting diode, a transparent sealing portion that is filled into the light reflecting portion and seals the light emitting diode, and a clay film that covers the silver plating layer. The transparent sealing portion and the light reflecting portion are bonded to each other.


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