The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Nov. 18, 2015
Applicant:

W&wsens, Devices Inc., Los Altos, CA (US);

Inventors:

Shih-Yuan Wang, Palo Alto, CA (US);

Shih-Ping Wang, Los Altos, CA (US);

Assignee:

W&Wsens Devices, Inc., Los Altos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0236 (2006.01); H01L 27/144 (2006.01); H01L 27/146 (2006.01); H04B 10/69 (2013.01); H01L 31/02 (2006.01); H01L 31/0232 (2014.01); H01L 31/09 (2006.01); H01L 31/103 (2006.01); H01L 31/028 (2006.01); H01L 31/107 (2006.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); H04B 10/80 (2013.01);
U.S. Cl.
CPC ...
H01L 31/02363 (2013.01); H01L 27/1443 (2013.01); H01L 27/1446 (2013.01); H01L 27/14625 (2013.01); H01L 31/02 (2013.01); H01L 31/028 (2013.01); H01L 31/0232 (2013.01); H01L 31/0236 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 31/09 (2013.01); H01L 31/103 (2013.01); H01L 31/107 (2013.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); H04B 10/691 (2013.01); H04B 10/6971 (2013.01); H04B 10/801 (2013.01);
Abstract

Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as holes, effectively increase the absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more. Their thickness dimensions allow them to be conveniently integrated on the same Si chip with CMOS, BiCMOS, and other electronics, with resulting packaging benefits and reduced capacitance and thus higher speeds.


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