The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
May. 16, 2016
Dexerials Corporation, Shinagawa-ku, Tokyo, JP;
Kazunori Hamazaki, Tochigi, JP;
Takashi Matsumura, Tochigi, JP;
Daisuke Sato, Tochigi, JP;
Yasuhiro Suga, Tochigi, JP;
Dexerials Corporation, Shinagawa-ku, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8×10to 1×10Pa·s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.