The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Aug. 22, 2014
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Katsumi Ishii, Kyoto, JP;

Masashi Yamaura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 2224/10165 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17519 (2013.01); H01L 2224/8114 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81444 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/15787 (2013.01);
Abstract

An electronic device includes a surface-mounted component and a mounting component on which the surface-mounted component is mounted, the surface-mounted component includes a first bump and a second bump, a cross-sectional area of which in an in-plane direction of a surface facing the mounting component is larger than that of the first bump, on the surface facing the mounting component, the mounting component includes a first pad that is soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and a ratio of an area of the second pad to the cross-sectional area of the second bump is larger than a ratio of an area of the first pad to the cross-sectional area of the first bump.


Find Patent Forward Citations

Ishii, Katsumi. (2016). Electronic device (U.S. Patent No. 9524946). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9524946

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…