The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
May. 14, 2015
Applicant:
Hyundai Motor Company, Seoul, KR;
Inventor:
Sung-Min Park, Seoul, KR;
Assignee:
HYUNDAI MOTOR COMPANY, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/565 (2013.01); H01L 23/3142 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01);
Abstract
A power semiconductor module may include a first device and a second device spaced apart from the first device at a predetermined interval. A first assembling terminal is fixedly disposed between the first device and the second device to be a first connection terminal. A second assembling terminal is fixedly assembled to contact outer surfaces of the first device and the second device to be a second connection terminal.