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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9524930 B1

PDFFull Text
Date of Patent:
Dec. 20, 2016

Filed:

Jan. 29, 2014

Configurable interposer

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Oleg Gluschenkov, Tannersville, NY (US);

Yunsheng Song, Poughkeepsie, NY (US);

Tso-Hui Ting, Stormville, NY (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Scully, Scott, Murphy & Presser, P.C.

Steven J. Meyers, Esq.

Primary Examiner:

Zandra Smith

Assistant Examiner:

Andre′ C Stevenson

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 23/13 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H05K 1/0286 (2013.01); H01L 22/20 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/1403 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/15311 (2013.01); H05K 1/142 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A modularized interposer includes a plurality of interposer units that are assembled to provide a complete set of electrical connections between two semiconductor chips. At least some of the plurality of interposer units can be replaced with other interposer units having an alternate configuration to enable selection of different functional parts of semiconductor chips to be connected through the modularized interposer. Bonding structures, connected to conductive metal pads located at peripheries of neighboring interposer units and an overlying or underlying portion of a semiconductor chip, can provide electrical connections between the neighboring interposer units. The interposer units can be provided by forming through-substrate vias (TSV's) in a substrate, forming patterned conductive structures on the substrate, and cutting the substrate into interposers.

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