The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Sep. 28, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/4334 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/5384 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/92 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 23/49524 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/35 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/26135 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/35847 (2013.01); H01L 2224/37005 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/4007 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/40991 (2013.01); H01L 2224/40993 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48111 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73271 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83136 (2013.01); H01L 2224/83139 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84007 (2013.01); H01L 2224/84136 (2013.01); H01L 2224/84138 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/92157 (2013.01); H01L 2224/92165 (2013.01); H01L 2224/92166 (2013.01); H01L 2224/92246 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/181 (2013.01);
Abstract
There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.