The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Jun. 25, 2015
Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventors:

Tzong-Shii Pan, San Jose, CA (US);

Yih-Jen Dennis Chen, Pleasanton, CA (US);

Wing Chun Shum, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
G11B 5/48 (2013.01); G11B 5/4846 (2013.01); G11B 5/4853 (2013.01); G11B 5/4833 (2013.01);
Abstract

A flexure tail of a head suspension assembly includes a structural layer, a conductive layer, a dielectric layer between the structural and conductive layers, and an insulative cover layer disposed on the conductive layer. The conductive layer includes a plurality of flexure bond pads in a terminal region of the flexure tail. The insulative cover layer includes a plurality of openings that expose each of the plurality of flexure bond pads. The dielectric layer defines a first thickness between the structural layer and the conductive layer at each of the plurality of flexure bond pads. The dielectric layer also defines a second thickness between the structural layer and the conductive layer adjacent to the plurality of flexure bond pads in the terminal region of the flexure tail. The second thickness is less than the first thickness by a thickness difference that is no less than a cover layer thickness.


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