The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Dec. 18, 2015
Applicant:

Johnson Electric S.a., Murten, CH;

Inventors:

Vincent Daniel Jean Salle, Hong Kong, CN;

Teck De Loi, Singapore, SG;

Arthur Demaso, Shanghai, CN;

Assignee:

JOHNSON ELECTRIC S.A., Murten, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07743 (2013.01); G06K 19/022 (2013.01); G06K 19/07722 (2013.01); H01L 23/49855 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/95 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8149 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/95115 (2013.01); H01L 2924/15313 (2013.01); H05K 3/244 (2013.01);
Abstract

A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.


Find Patent Forward Citations

Salle, Vincent Daniel Jean. (2016). Contact smart card (U.S. Patent No. 9524459). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9524459

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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