The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Jul. 10, 2015
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takamitsu Kitamura, Fujisawa, JP;

Hideki Yagi, Machida, JP;

Daisuke Kimura, Yokohama, JP;

Hirohiko Kobayashi, Machida, JP;

Masataka Watanabe, Kamakura, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/025 (2006.01); G02F 1/21 (2006.01); G02F 1/225 (2006.01);
U.S. Cl.
CPC ...
G02F 1/025 (2013.01); G02F 1/218 (2013.01); G02F 1/2255 (2013.01);
Abstract

A semiconductor optical modulator includes a substrate having a principal surface; a waveguide disposed on the principal surface of the substrate, the waveguide extending in a first direction; a first electrode disposed on the waveguide, the first electrode being in contact with an upper surface of the waveguide; a first wiring connected to the first electrode, the first wiring extending in a second direction intersecting the first direction; a build-up portion connected to the first wiring; a second wiring connected to the build-up portion, the second wiring extending in a plane parallel to the principal surface of the substrate; and a resin layer disposed on the substrate, the resin layer embedding the first wiring and the build-up portion. The build-up portion extends along a third direction, the third direction intersecting perpendicularly to the principal surface of the substrate. The second wiring is disposed on the resin layer.


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