The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Feb. 07, 2014
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Norio Ishitsuka, Tokyo, JP;
Masatoshi Ogata, Tokyo, JP;
Tsutomu Kono, Tokyo, JP;
Tsubasa Watanabe, Tokyo, JP;
Shinobu Tashiro, Hitachinaka, JP;
Noboru Tokuyasu, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
An objective of the present invention is, in a thermal flow meter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement elementon support membersand, the gas flow measurement elementincluding a cavity portionsurrounded by a substrate inclined portioninclined to a substrate surface, a diaphragmthat covers the cavity portion, and an electrical resistive element formed in the diaphragm; and covering the gas flow measurement elementand the support membersandwith the resin portionformed with the mold, to set the moldsuch that an acting portion of pressure force by the mold that molds the resin portionis positioned outside the substrate inclined portionin the entire periphery of the diaphragm