The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Sep. 02, 2013
Applicants:

Og Corporation, Osaka-shi, Osaka, JP;

T. Chatani & Co., Ltd., Osaka-shi, Osaka, JP;

Inventors:

Kouji Ono, Tokyo, JP;

Takeshi Sumi, Osaka, JP;

Assignees:

OG Corporation, Osaka-shi, Osaka, JP;

T. Chatani & Co., Ltd., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 7/04 (2006.01); F21V 19/00 (2006.01); G02F 1/1335 (2006.01); F21V 8/00 (2006.01); F21Y 101/00 (2016.01);
U.S. Cl.
CPC ...
F21V 19/002 (2013.01); G02B 6/009 (2013.01); G02B 6/0073 (2013.01); F21V 19/0015 (2013.01); F21V 19/0025 (2013.01); F21Y 2101/00 (2013.01); G02B 6/0068 (2013.01); G02B 6/0083 (2013.01); G02F 2001/133628 (2013.01);
Abstract

A substrate is formed in a rectangular shape, a plurality of light emitting elements are arranged on one end face of the substrate, and a translucent sealing material is adhered to the one end face to seal the light emitting elements. A light irradiation device is thin, which transfers heat generated at the light emitting elements to the substrate where the heat is dissipated. Even if the substrate is made thinner, the heat dissipation performance of the substrate can be maintained or enhanced when the dimension of the substrate is increased in the direction intersecting the one end face of the substrate.


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