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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9522998 B1

PDFFull Text
Date of Patent:
Dec. 20, 2016

Filed:

Apr. 09, 2013

Resin mold material composition for imprinting

Applicant:

Daikin Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Tsuneo Yamashita, Settsu, JP;

Masamichi Morita, Settsu, JP;

Yoshiko Kuwajima, Settsu, JP;

Assignee:

DAIKIN INDUSTRIES, LTD., Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Lan Vinh

Int. Cl.
CPC ...
C09K 13/06 (2006.01); C08L 33/16 (2006.01); B29C 33/40 (2006.01); G03F 7/00 (2006.01); B29C 33/38 (2006.01); B29C 33/42 (2006.01); B29C 43/00 (2006.01); B29C 43/02 (2006.01); B29C 43/50 (2006.01); B29C 71/04 (2006.01); C08L 37/00 (2006.01); H01L 21/308 (2006.01); B29K 33/00 (2006.01); B29K 105/00 (2006.01); B29K 105/24 (2006.01); B29L 31/00 (2006.01); C08G 77/14 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08L 33/16 (2013.01); B29C 33/3857 (2013.01); B29C 33/40 (2013.01); B29C 33/424 (2013.01); B29C 43/003 (2013.01); B29C 43/02 (2013.01); B29C 43/50 (2013.01); B29C 71/04 (2013.01); C08L 37/00 (2013.01); G03F 7/0002 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); B29C 2043/025 (2013.01); B29K 2033/12 (2013.01); B29K 2105/0014 (2013.01); B29K 2105/0085 (2013.01); B29K 2105/0088 (2013.01); B29K 2105/24 (2013.01); B29L 2031/757 (2013.01); C08G 77/14 (2013.01); C08G 77/20 (2013.01); C08L 2205/06 (2013.01); C08L 2312/06 (2013.01);
Abstract

Provided are: a resin mold material and a resin replica mold material composition for imprinting having a superior mold releasability; a resin mold and a resin replica mold resulting from containing the material composition; and a method for producing them. The resin mold material or resin replica mold material composition for imprinting contains 100 parts by weight of a mold resin or replica mold resin for imprinting and 0.1 to 10 parts by weight of a curable fluoropolymer (A). Preferably, the fluoropolymer (A) has a weight-average molecular weight of 3,000 to 20,000 and results from including as repeating units (a1) an α-position substituted acrylate having a fluoroalkyl group having 4 to 6 carbon atoms and (a2) and 5 to 120 parts by weight of a high-softening-point monomer exhibiting a glass transition point or softening point of at least 50° C. in the homopolymer state.

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