The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Nov. 12, 2008
Applicants:

Michelle Khine, Irvine, CA (US);

Chi-shuo Chen, Merced, CA (US);

Anthony Grimes, Merced, CA (US);

David Nate Breslauer, Berkeley, CA (US);

Luke Lee, Orinda, CA (US);

Michael Dunlap, Merced, CA (US);

Ajay Gopinathan, Merced, CA (US);

Sayantani Ghosh, Merced, CA (US);

Inventors:

Michelle Khine, Irvine, CA (US);

Chi-shuo Chen, Merced, CA (US);

Anthony Grimes, Merced, CA (US);

David Nate Breslauer, Berkeley, CA (US);

Luke Lee, Orinda, CA (US);

Michael Dunlap, Merced, CA (US);

Ajay Gopinathan, Merced, CA (US);

Sayantani Ghosh, Merced, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/00 (2006.01); B81C 1/00 (2006.01); B01F 5/00 (2006.01); B01F 5/06 (2006.01); B01F 13/00 (2006.01); B01L 3/00 (2006.01); H01L 21/02 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B81C 1/00071 (2013.01); B01F 5/0057 (2013.01); B01F 5/0646 (2013.01); B01F 5/0647 (2013.01); B01F 13/0059 (2013.01); B01L 3/502707 (2013.01); H01L 21/02271 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0338 (2013.01); B82Y 40/00 (2013.01); H01L 21/02269 (2013.01);
Abstract

A method is provided to prepare one or more microfluidic channels on a receptive material by applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern and heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. In an alternative aspect, the microfluidic channels on receptive material are prepared by etching a designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%.


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