The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Aug. 30, 2010
Applicants:
Aki Hidaka, Miyazaki, JP;
Yoshitaka Katsukawa, Kyoto, JP;
Tsuyoshi Okamoto, Kyoto, JP;
Inventors:
Assignee:
SANYO CHEMICAL INDUSTRIES, LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); B28D 5/00 (2006.01); C10M 173/02 (2006.01);
U.S. Cl.
CPC ...
B28D 5/0076 (2013.01); C10M 173/02 (2013.01); C10M 2207/02 (2013.01); C10M 2207/0225 (2013.01); C10M 2207/04 (2013.01); C10M 2207/0406 (2013.01); C10M 2207/046 (2013.01); C10M 2207/122 (2013.01); C10M 2207/123 (2013.01); C10M 2207/124 (2013.01); C10M 2207/126 (2013.01); C10M 2207/127 (2013.01); C10M 2207/128 (2013.01); C10M 2207/1233 (2013.01); C10M 2207/1273 (2013.01); C10M 2207/142 (2013.01); C10M 2207/1403 (2013.01); C10M 2215/042 (2013.01); C10M 2219/044 (2013.01); C10M 2221/04 (2013.01); C10N 2210/01 (2013.01); C10N 2230/06 (2013.01); C10N 2230/18 (2013.01); C10N 2240/401 (2013.01); C10N 2240/50 (2013.01);
Abstract
A water-soluble cutting fluid for slicing silicon ingots is characterized in that it includes a monoprotic or diprotic aliphatic carboxylic acid (A) having a carbon number (including the carbon in the carbonyl group) of 4˜10, and either a polyprotic organic acid (B) with ΔpKa of 0.9˜2.3 as defined by the following formula (1) or a salt (BA) of said organic acid (B) as essential components:ΔpKa=(pKa)−(pKa)  (1)
Quick Actions:
Hidaka, Aki. (2016). Water-soluble cutting fluid for slicing silicon ingots (U.S. Patent No. 9522481). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9522481
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile