The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Nov. 30, 2011
Applicant:

Istvan Bakk, Törökbalint, HU;

Inventor:

Istvan Bakk, Törökbalint, HU;

Assignee:

Tridonic Jennersdorf GmbH, Jennersdorf, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F21V 29/503 (2015.01); H01L 23/433 (2006.01); F04F 7/00 (2006.01); F21V 29/02 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); F21V 29/63 (2015.01); F21V 29/74 (2015.01); F21V 29/83 (2015.01); F21Y 101/00 (2016.01);
U.S. Cl.
CPC ...
H05K 7/20136 (2013.01); F04F 7/00 (2013.01); F21K 9/23 (2016.08); F21K 9/232 (2016.08); F21V 29/02 (2013.01); F21V 29/503 (2015.01); F21V 29/63 (2015.01); F21V 29/74 (2015.01); H01L 23/467 (2013.01); H01L 23/4735 (2013.01); F21V 29/83 (2015.01); F21Y 2101/00 (2013.01); H01L 2924/0002 (2013.01); Y02B 20/30 (2013.01);
Abstract

The present invention is directed to a cooling system () for electronic components (). The cooling system () comprises means () for producing cyclic air pressure fluctuations, wherein the electronic components () are distanced from the pressure producing means (). In the vicinity of the electronic components () are situated means (), preferably restrictions like holes, which are affected by the cyclic air pressure fluctuations, and which produce cyclic air jets (). The air jets () affect the surface of the electronic component (), and since the air jets () originate directly in the vicinity of the electronic components (), an efficient heat transfer is affected. Preferably, the pressure producing means () actuate a pressure Pc inside a chamber (), and turbulent air jets () are produced through holes () of a substrate (), onto which electronic components () are mounted.


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