The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Sep. 06, 2012
Applicants:

Nicholas G. Lang, Cincinnati, OH (US);

Donald J. Schenk, Hamilton, OH (US);

Inventors:

Nicholas G. Lang, Cincinnati, OH (US);

Donald J. Schenk, Hamilton, OH (US);

Assignee:

SIEMENS INDUSTRY, INC., Alpharetta, GA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 9/22 (2006.01); H02K 5/18 (2006.01); H02K 9/06 (2006.01); H02K 9/08 (2006.01); H02K 9/14 (2006.01);
U.S. Cl.
CPC ...
H02K 5/18 (2013.01); H02K 9/08 (2013.01); H02K 9/14 (2013.01); H02K 9/22 (2013.01); H02K 9/06 (2013.01); Y10T 29/49009 (2015.01);
Abstract

A heat sink apparatus for induction motors and other dynamoelectric machines. The heat sink has a mounting portion adapted for coupling to a motor housing. A first heat sink portion is adapted for insertion into a motor housing interior, such as through an aperture in the frame or bearing bracket, and is thermally coupled to a second heat sink portion that is adapted for orientation outside the housing. The heat sink apparatus first heat sink portion may be inserted within an air channel of a TEFC induction motor. The heat sink preferably has a higher heat transfer rate than the motor housing.


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