The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Apr. 28, 2015
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventor:
Tae Kyung Kim, Chungcheongbuk-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 27/115 (2006.01); H01L 23/528 (2006.01); H01L 23/535 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/76897 (2013.01); H01L 23/528 (2013.01); H01L 23/535 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a core insulating film, a channel film surrounding the core insulating film and extending to a higher level than an upper surface of the core insulating film to have a first end of the channel film exposed over the core insulating film, a channel pad formed over an inner wall of the first end of the channel film exposed over the core insulating film, and a contact plug coupled to the channel pad.