The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Jan. 08, 2015
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventor:
Yuichi Higuchi, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 21/563 (2013.01); H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05613 (2013.01); H01L 2224/05617 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05657 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13117 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/16014 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/207 (2013.01); H01L 2924/2075 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/381 (2013.01); H01L 2924/384 (2013.01);
Abstract
A semiconductor device includes multilayer chips in which a first semiconductor chip and a second semiconductor chip are bonded together. A first electrode pad is formed on a principal surface of the first semiconductor chip, and a first bump is formed on the first electrode pad. A second bump is formed on the principal surface of the second semiconductor chip such that the second bump is bonded to the first bump. The first electrode pad has an opening, and the opening and an entire peripheral portion of the opening form a stepped shape form a stepped shape. The first bump has a recessed shape that is recessed at a center thereof and covers the stepped shape.
Higuchi, Yuichi. (2016). Semiconductor device for use in flip-chip bonding, which reduces lateral displacement (U.S. Patent No. 9520381). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9520381
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile