The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Sep. 09, 2015
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventors:
John A. Chiesa, Pelham, NH (US);
Cemin Zhang, Nashua, NH (US);
Byungmoo Min, Lexington, MA (US);
Ekrem Oran, Nashua, NH (US);
John N. Poelker, Andover, MA (US);
Assignee:
Analog Devices, Inc., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H03L 7/24 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H03L 7/24 (2013.01); H01L 2223/6683 (2013.01);
Abstract
A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by vias through the low loss substrate. The ground plane is positioned to concentrate high frequency electromagnetic fields in the low loss substrate. A tuning height can be adjusted to tune the center frequency of a circuit in the die.