The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Apr. 02, 2015
Applicants:

Tokyo Metropolitan University, Tokyo, JP;

Okitsumo Incorporated, Mie, JP;

Inventors:

Hideki Masuda, Tokyo, JP;

Toshiaki Kondo, Tokyo, JP;

Takashi Toyonaga, Mie, JP;

Naoshi Kimura, Mie, JP;

Fumitaka Yoshioka, Mie, JP;

Assignees:

TOKYO METROPOLITAN UNIVERSITY, Tokyo, JP;

OKITSUMO INCORPORATED, Nabari-Shi, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); C25F 3/04 (2006.01); C25F 3/14 (2006.01); C25F 3/20 (2006.01); C23F 1/20 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01); C23C 14/00 (2006.01); C23C 14/04 (2006.01); C23C 14/20 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01); C25F 3/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); C23C 14/0021 (2013.01); C23C 14/042 (2013.01); C23C 14/205 (2013.01); C23C 14/34 (2013.01); C23C 14/5846 (2013.01); C23C 14/5873 (2013.01); C23C 14/5886 (2013.01); C23F 1/20 (2013.01); C25F 3/04 (2013.01); C25F 3/14 (2013.01); C25F 3/20 (2013.01); C25F 3/22 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H05K 7/20 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity wall defining each microcavity is suppressed or in which microcavities each having an aspect ratio larger than 3.0 are formed. For the wavelength selective heat radiation material, a base material having a mask having predetermined openings tightly adhered to a surface thereof, or a base material in which depressions are previously formed on one surface thereof by pressing a die having projections arrayed so as to correspond to positions of microcavities thereagainst, is subjected to anisotropic etching, thereby providing a wavelength selective heat radiation material in which the surface roughness of the upper portion of the cavity wall defining each of the microcavities is suppressed or a wavelength selective heat radiation material having microcavities whose each aspect ratio is larger than 3.0.


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