The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Jan. 14, 2014
Applicants:
Stmicroelectronics SA, Montrouge, FR;
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Anne Lombardot, Chenia les Vernes, FR;
Inventors:
Assignees:
STMICROELECTRONICS (CROLLES 2) SAS, Crolles, FR;
STMICROELECTRONICS SA, Montrouge, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/3128 (2013.01); H01L 23/4275 (2013.01); H01L 23/4334 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 29/0657 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01);
Abstract
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.