The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Nov. 07, 2012
Applicant:

Fuji Machine Mfg. Co., Ltd., Chiryu, JP;

Inventors:

Toshihiko Yamasaki, Nisshin, JP;

Toshinori Shimizu, Kariya, JP;

Hiroyasu Ohashi, Toyota, JP;

Masaki Murai, Nishio, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); B25J 11/0095 (2013.01); B25J 15/0028 (2013.01); H01L 21/67144 (2013.01); H01L 21/67346 (2013.01); H01L 21/68707 (2013.01); H01L 21/68721 (2013.01); H01L 21/68728 (2013.01);
Abstract

A chip supplying apparatus supplies a chip to a mounting machine which mounts the chip on a substrate is disclosed. The chip supplying apparatus includes wafer table which holds a wafer sheet at a position where an operation head of the mounting machine can receive the chip. In the chip supplying apparatus, the wafer table is provided with a frame, a stopper which is fixed to the center of a front portion of the frame and abuts against a front end of the wafer sheet, and a pair of clamp mechanisms which is supported by the frame and which clamps both side ends of the wafer sheet. In the chip supplying apparatus, a position of the pair of clamp mechanisms in a right-and-left direction with respect to the frame can be changed in multiple steps.


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