The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Jan. 29, 2015
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Edward Carl Fisher, Lucas, TX (US);
Jane Qian Liu, Plano, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); B05B 1/14 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); B05B 1/14 (2013.01); G02B 26/0833 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/96 (2013.01); H01L 2224/96 (2013.01);
Abstract
Microelectromechanical systems (MEMS) such as digital micromirror devices (DMD) are manufactured in arrays. Covers, packages, and lids are placed around each device and a liquid such as epoxy resin is dispensed around the packaged device. The epoxy resin acts as a sealant to form a hermetic seal. A nozzle comprises multiple orifices along a sidewall of the nozzle to dispense the epoxy resin horizontally and parallel to the plane of the wafer substrate. The distal ends of the nozzle are enclosed.