The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Mar. 27, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Sang Soo Park, Suwon-Si, KR;
Soon Ju Lee, Suwon-Si, KR;
Young Ghyu Ahn, Suwon-Si, KR;
Heung Kil Park, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01G 4/30 (2006.01); H01C 1/14 (2006.01); H01C 1/148 (2006.01); H01C 7/18 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H05K 3/34 (2006.01); H01G 4/12 (2006.01); H01C 7/00 (2006.01); H01C 7/10 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01C 1/14 (2013.01); H01C 1/148 (2013.01); H01C 7/18 (2013.01); H01G 2/065 (2013.01); H01G 4/232 (2013.01); H05K 3/3442 (2013.01); H01C 7/008 (2013.01); H01C 7/10 (2013.01); H01G 4/12 (2013.01); H05K 1/141 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2045 (2013.01);
Abstract
There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.