The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Dec. 18, 2012
Applicant:
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Inventor:
Masaki Yoneda, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/148 (2006.01); H01C 7/00 (2006.01); H01C 17/28 (2006.01); H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
H01C 17/006 (2013.01); H01C 1/148 (2013.01); H01C 7/003 (2013.01); H01C 17/28 (2013.01); H01C 17/281 (2013.01); H01C 17/288 (2013.01); Y10T 29/49082 (2015.01); Y10T 29/49101 (2015.01);
Abstract
A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.