The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Mar. 28, 2014
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); G11C 5/06 (2006.01); G11C 7/10 (2006.01); G11C 11/4093 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G11C 5/06 (2013.01); G11C 7/109 (2013.01); G11C 11/4093 (2013.01); H05K 1/0253 (2013.01); G11C 2207/105 (2013.01); H05K 1/0225 (2013.01); H05K 2201/09327 (2013.01); H05K 2201/10159 (2013.01);
Abstract
A memory module includes a plurality of semiconductor memory devices and a circuit board. The circuit board is electrically connected to the plurality of semiconductor memory devices, and a signal line is disposed in the outermost layer of the circuit board. An electrical reference for the signal line is provided in a layer of the circuit board that is not adjacent to the outermost layer. Accordingly, an impedance of the signal line may be increased, and signal integrity of a signal transmitted through the signal line may be improved.