The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Jan. 12, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Robert L. Hubbard, Eugene, OR (US);

Iftikhar Ahmad, Raleigh, NC (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/26 (2006.01); G03F 7/38 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); B05D 3/06 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/38 (2013.01); G03F 7/0387 (2013.01); G03F 7/40 (2013.01); H01L 21/02118 (2013.01); H01L 21/02337 (2013.01); H01L 21/311 (2013.01); B05D 3/029 (2013.01); B05D 3/06 (2013.01); B05D 2505/50 (2013.01);
Abstract

A method for curing photosensitive polyimide (PSPI) films includes the steps of: depositing a PSPI film on a selected substrate, and curing the film by microwave heating at a selected temperature from about 200 to 340° C. in a selected atmosphere containing an oxygen concentration from about 20 to 200,000 ppm. The process atmosphere may be static or flowing. The addition of oxygen improves the removal of acrylate residue and improves the Tof the cured film, while the low processing temperature characteristic of the microwave process prevents the oxygen from damaging the polyimide backbone. The method may further include the steps of photopatterning and developing the PSPI film prior to curing. The process is particularly suitable for dielectric films on silicon for electronic applications.


Find Patent Forward Citations

Loading…