The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Oct. 12, 2012
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Mathias Bruendel, Stuttgart, DE;

Andre Gerlach, Leonberg-Hoefingen, DE;

Christina Leinenbach, Karlsruhe, DE;

Sonja Knies, Rutesheim, DE;

Ando Feyh, Palo Alto, CA (US);

Ulrike Scholz, Korntal, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0023 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); H04R 31/006 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.


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