The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2016

Filed:

Feb. 27, 2013
Applicant:

Shachihata Inc., Naogoya-shi, Aichi, JP;

Inventors:

Eiji Abe, Anjo, JP;

Masayoshi Uchida, Ichinomiya, JP;

Assignee:

SHACHIHATA INC., Nagoya-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41K 1/38 (2006.01); B41K 1/50 (2006.01); B41D 7/04 (2006.01); B41K 1/00 (2006.01); B41D 7/00 (2006.01);
U.S. Cl.
CPC ...
B41K 1/50 (2013.01); B41D 7/00 (2013.01); B41D 7/04 (2013.01); B41K 1/00 (2013.01); B41K 1/38 (2013.01); Y10T 156/17 (2015.01);
Abstract

The present invention relates to a porous stamp assembly. The manufacturing method of the assembly comprises a first step of hermetically adhering a porous impression die member of thermoplastic resin to a front end face of a frame; a second step of fixing the die member embedded frame onto a mount that is to be in face-to-face relation with a thermal head attached to a seal carving device; a third step of putting the thermal head in contact with an impression surface of the porous impression die member, with a resin film interposed therebetween, and moving the thermal head and the porous impression die member relative to each other; and a fourth step of removing the die member embedded frame from the mount.


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