The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Feb. 12, 2015
Seiko Epson Corporation, Tokyo, JP;
Tsuyoshi Yoda, Matsumoto, JP;
Seiko Epson Corporation, , JP;
Abstract
A wiring mounting structure includes: a first base that has a first main surface, a second main surface that is an undersurface opposite to the first main surface, and an inclined surface that is formed between the first main surface and the second main surface to have an angle as a reference angle with the second main surface, which is less than 90 degrees; a second base that has a third main surface which is joined to the second main surface of the first base; an adhesive which is disposed between the second main surface of the first base and the third main surface of the second base from an end portion of the inclined surface of the first base to an exposed region on the third main surface of the second base and by which the first base and the second base are joined; and a connection wiring that is provided to be continuous on from the inclined surface through the front surface of the adhesive to the third main surface of the second base. The front surface of the adhesive is provided to be continuous to the inclined surface and thus an angle formed between the front surface of the adhesive in a portion in which the adhesive is provided to be continuous to the inclined surface and the third main surface on which the adhesive is provided is less than the reference.