The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Dec. 10, 2012
Applicant:

Shibuya Kogyo Co., Ltd., Kanazawa-shi, Ishikawa-ken, JP;

Inventor:

Kazunari Ikeda, Kanazawa, JP;

Assignee:

SHIBUYA KOGYO CO., LTD., Kanazawa-shi, Ishikawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); B23K 1/20 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3478 (2013.01); B23K 1/20 (2013.01); H01L 21/4853 (2013.01); H05K 2203/041 (2013.01); H05K 2203/0557 (2013.01); H05K 2203/082 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49149 (2015.01); Y10T 29/53191 (2015.01);
Abstract

A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting portions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in portions corresponding to the mounting portions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount.


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