The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jun. 14, 2013
Applicant:

Osram Gmbh, Munich, DE;

Inventors:

Jianghui Yang, Shenzhen Guangdong, CN;

Chuanpeng Zhong, Shenzhen Guangdong, CN;

Hao Li, Shenzhen Guangdong, CN;

Xiaomian Chen, Shenzhen Guangdong, CN;

Assignee:

OSRAM GMBH, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); H05K 1/0201 (2013.01); H05K 1/0203 (2013.01); H05K 1/0204 (2013.01); H05K 1/0284 (2013.01); H05K 1/0306 (2013.01); H05K 1/056 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H05K 1/142 (2013.01); H05K 2201/048 (2013.01); H05K 2201/06 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10416 (2013.01); Y10T 29/49155 (2015.01);
Abstract

Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.


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