The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Nov. 21, 2012
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); B32B 5/02 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 17/04 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); B32B 5/022 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 17/04 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); H05K 1/036 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2307/54 (2013.01); B32B 2457/08 (2013.01); H05K 1/0366 (2013.01); H05K 3/022 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/029 (2013.01); Y10T 428/2495 (2015.01);
Abstract
A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.