The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

May. 07, 2014
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventor:

Jens Pollmann-Retsch, Aachen, DE;

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 5/18 (2006.01); H01S 5/022 (2006.01); B23K 1/00 (2006.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); B23K 1/0016 (2013.01); H01S 5/02252 (2013.01); H01S 5/02272 (2013.01); H01S 5/18 (2013.01); H01S 5/183 (2013.01); H01S 5/423 (2013.01); H01L 25/0753 (2013.01); H01L 33/648 (2013.01); H01L 2924/0002 (2013.01); H01S 5/02268 (2013.01); H01S 5/02476 (2013.01);
Abstract

The invention describes a mounting layer () for mounting at least two light emitting semiconductor devices. The mounting layer () comprises corner protrusion () and edge protrusion () for aligning the mounting layer () to the cooling structure (). The mounting layer () further comprises aligning holes () defining mounting areas () for mounting the light emitting semiconductor devices. The mounting layer () enables, for example, manufacturing of a μ-channel cooler with mounting areas () by means of one direct bonding process. Tolerances may thus be reduced. The invention further describes a cooling structure () like a μ-channel cooler comprising such a mounting layer () and a light emitting structure comprising such a cooling structure (). Furthermore, methods of manufacturing such a mounting layer (), cooling structure () and light emitting structure are described.


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